C

Dr.-Ing. Thorben Casper

Contact

work +49 6151 16-24392
fax +49 6151 16-24027

Work S4|10 228
Dolivostraße 15
64293 Darmstadt

In the field of micro- and nanoelectronics, feature sizes are steadily shrinking, see e.g. G. E. Moore, “Cramming more components onto integrated circuits”, Electronics, vol. 38, no. 8, 1965. Power densities increase and with them the need for thermal considerations. Since resulting temperature fields may raise system failures, an electrothermal analysis is required. A common example is the failure of bond wires in microelectronic chip packages when exceeding a critical temperature.

Today’s complexity in the design and fabrication of electronic components leads to a great significance of numerical simulations. The simulation of models with large variations in component sizes requires specific numerical techniques to avoid high computational costs. Field-circuit coupling is just one of the possible methods to establish efficient models. Another field of focus is the problem of manufacturing imperfections. Not only the geometry but also the material parameters are subject to uncertainty that needs to be quantified. For the efficient calculation of failure probabilities, reduced order models are essential.

Jump to: 2019 | 2018 | 2017 | 2016 | 2015
Number of items: 26.

2019

Duque, David José and Casper, Thorben and Schöps, Sebastian and De Gersem, Herbert and Römer, Ulrich and Gillon, Renaud and Wieers, Aarnout and Kratochvíl, Tomáš and Götthans, Tomáš and Meuris, Peter (2019):
Bond Wire Models.
In: Mathematics in Industry, In: Nanoelectronic Coupled Problems Solutions, Cham, Springer, pp. 43-68, DOI: 10.1007/978-3-030-30726-4_3,
[Online-Edition: https://link.springer.com/chapter/10.1007/978-3-030-30726-4_...],
[Book Section]

Casper, Thorben and Duque, David José and Schöps, Sebastian and De Gersem, Herbert (2019):
Automated Generation of Netlists from Electrothermal Field Models.
In: Mathematics in Industry, In: Nanoelectronic Coupled Problems Solutions, Cham, Springer, pp. 93-113, DOI: 10.1007/978-3-030-30726-4_5,
[Online-Edition: https://link.springer.com/chapter/10.1007/978-3-030-30726-4_...],
[Book Section]

Casper, Thorben and Römer, Ulrich and De Gersem, Herbert and Schöps, Sebastian (2019):
Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging.
In: Computers & Mathematics with Applications, ISSN 0898-1221, DOI: 10.1016/j.camwa.2019.10.009,
[Online-Edition: https://www.sciencedirect.com/science/article/pii/S089812211...],
[Article]

Casper, Thorben (2019):
Electrothermal Field and Circuit Simulation of Thin Wires and Evaluation of Failure Probabilities.
Darmstadt, Technische Universität, [Online-Edition: https://tuprints.ulb.tu-darmstadt.de/8959],
[Ph.D. Thesis]

Hirmer, Katrin and Casper, Thorben and Schöps, Sebastian and Hofmann, Klaus Bogenfeld, Eckard (ed.) (2019):
3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements.
In: URSI Kleinheubacher Tagung (KHB 2019), Miltenberg, 23.–25.09.2019, [Online-Edition: https://www.kh2019.de],
[Conference or Workshop Item]

Casper, Thorben and Duque, David and Schöps, Sebastian and De Gersem, Herbert (2019):
Automated Netlist Generation for 3D Electrothermal and Electromagnetic Field Problems.
1809.08588, In: Journal of Computational Electronics, [Article]

Krimm, Alexander and Casper, Thorben and Schöps, Sebastian and De Gersem, Herbert and Chamoin, Ludovic (2019):
Proper Generalized Decomposition of Parameterized Electrothermal Problems Discretized by the Finite Integration Technique.
55, In: IEEE Transactions on Magnetics, (6), IEEE, ISSN 0018-9464, DOI: 10.1109/TMAG.2019.2907223,
[Online-Edition: https://doi.org/10.1109/TMAG.2019.2907223],
[Article]

2018

Casper, Thorben and Duque, David and Schöps, Sebastian and De Gersem, Herbert (2018):
Electric Circuits for Exact Representations of Spatially Discretised Electrothermal and Electromagnetic 3D Field Problems.
Maxwell in Motion, In: Workshop on Advances in Electromagnetic Research — KWT 2018, Rietzlern, Austria, [Online-Edition: http://maxwell-in-motion.org],
[Conference or Workshop Item]

Loukrezis, Dimitrios and Römer, Ulrich and Casper, Thorben and Schöps, Sebastian and De Gersem, Herbert (2018):
High Dimensional Uncertainty Quantification for an Electrothermal Field Problem using Stochastic Collocation on Sparse Grids and Tensor Train Decomposition.
31, In: International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, (2), ISSN 1099-1204, [Online-Edition: https://doi.org/10.1002/jnm.2222],
[Article]

Bigalke, Steve and Lienig, Jens and Casper, Thorben and Schöps, Sebastian Gola, Alberto (ed.) (2018):
Increasing EM Robustness of Placement and Routing Solutions based on Layout-Driven Discretization.
In: 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME 2018), IEEE, DOI: 10.1109/PRIME.2018.8430323,
[Online-Edition: https://doi.org/10.1109/PRIME.2018.8430323],
[Book Section]

2017

Casper, Thorben and Römer, Ulrich and Schöps, Sebastian Dyczij-Edlinger, Romanus (ed.) (2017):
Determining Bond Wire Temperatures in Electronic Devices by a 1D-3D Coupling Approach.
Miltenberg, In: URSI Kleinheubacher Tagung (KHB 2017), Miltenberg, [Online-Edition: https://www.kh2017.de],
[Conference or Workshop Item]

Casper, Thorben and Römer, Ulrich and Schöps, Sebastian Schäfer, Michael (ed.) (2017):
On the Simulation of Thin Wires in a Coupled 1D-3D Setting.
Darmstadt, Germany, In: 4th International Conference on Computational Engineering (ICCE 2017), Darmstadt, Germany, [Conference or Workshop Item]

Casper, Thorben (2017):
1D-3D Coupling to Include Thin Wires in Electrothermal Simulations Using FIT.
In: Workshop on Advances in Electromagnetic Research — KWT 2017, [Online-Edition: http://maxwell-in-motion.org],
[Conference or Workshop Item]

Römer, Ulrich and Casper, Thorben and Schöps, Sebastian (2017):
Uncertainty Quantification for a Singular Electrothermal Coupled Problem with Error Control.
Rhodes Island, Greece, In: UNCECOMP 2017, Rhodes Island, Greece, [Online-Edition: https://2017.uncecomp.org],
[Conference or Workshop Item]

Casper, Thorben and Römer, Ulrich and Schöps, Sebastian Jung, Hyun-Kyo (ed.) (2017):
An Electrothermal 1D-3D Coupling Approach for Thin Wires in Microelectronic Chip Packages.
Daejeon, Korea, In: 21th Conference on the Computation of Electromagnetic Fields, Daejeon, Korea, [Online-Edition: http://www.compumag2017.com],
[Conference or Workshop Item]

2016

Casper, Thorben and Duque, David and Schöps, Sebastian and De Gersem, Herbert (2016):
Equivalent Netlist Extraction for Electrothermal and Electromagnetic Problems Discretized by the Finite Integration Technique.
In: 11th Conference on Scientific Computing in Electrical Engineering (SCEE 2016), [Online-Edition: http://www.ricam.oeaw.ac.at/events/conferences/scee2016],
[Conference or Workshop Item]

Casper, Thorben and Römer, Ulrich and Schöps, Sebastian (2016):
Determination of Bond Wire Failure Probabilities in Microelectronic Packages.
Budapest, In: 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Budapest, 21-23 Sept. 2016, pp. 39-44, DOI: 10.1109/THERMINIC.2016.7748645,
[Online-Edition: https://doi.org/10.1109/THERMINIC.2016.7748645],
[Conference or Workshop Item]

Duque, David and Casper, Thorben and Schöps, Sebastian and De Gersem, Herbert Wasenmüller, Uwe and Sauer-Greff, Wolfgang (eds.) (2016):
A Circuit-Based Approach for the Solution of Electrothermal and Electromagnetic Problems.
Miltenberg, In: URSI Kleinheubacher Tagung (KHB 2016), Miltenberg, [Online-Edition: https://www.kh2016.de],
[Conference or Workshop Item]

Casper, Thorben and De Gersem, Herbert and Gillon, Renaud and Gotthans, Tomas and Kratochvíl, Tomáš and Meuris, Peter and Schöps, Sebastian Fanucci, Luca and Teich, Jürgen (eds.) (2016):
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
In: Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE), IEEE, pp. 1297-1302, [Online-Edition: http://ieeexplore.ieee.org/document/7459510],
[Book Section]

Casper, Thorben and Römer, Ulrich and Schöps, Sebastian (2016):
Efficient Evaluation of Bond Wire Fusing Probabilities.
In: SIAM Conference on Uncertainty Quantification 2016, [Online-Edition: https://www.siam.org/meetings/uq16/],
[Conference or Workshop Item]

Casper, Thorben and De Gersem, Herbert and Schöps, Sebastian (2016):
Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models.
In: EuroSimE 2016, [Conference or Workshop Item]

Loukrezis, Dimitrios and Römer, Ulrich and Casper, Thorben and Schöps, Sebastian and De Gersem, Herbert (2016):
Application of High Dimensional Uncertainty Quantification Methods to Electrothermal Field Problems.
In: 10th International Symposium on Electric and Magnetic Fields (EMF 2016), [Online-Edition: http://www.aimontefiore.org/emf2016/],
[Conference or Workshop Item]

Casper, Thorben and De Gersem, Herbert and Gotthans, Tomas and Schoenmaker, Wim and Schöps, Sebastian and Wieers, Aarnout (2016):
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
In: DATE 2016, [Conference or Workshop Item]

Casper, Thorben and De Gersem, Herbert and Schöps, Sebastian (2016):
Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models.
In: 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp. 1-8, [Online-Edition: https://doi.org/10.1109/EuroSimE.2016.7463329],
[Book Section]

ter Maten, E. Jan W. and Schöps, Sebastian and Duque, David and Casper, Thorben and De Gersem, Herbert and Römer, Ulrich (2016):
Nanoelectronic COupled problems solutions - nanoCOPS: modelling, multirate, model order reduction, uncertainty quantification, fast fault simulation.
7, In: Journal of Mathematics in Industry, (2), Springer, ISSN 2190-5983, [Online-Edition: https://dx.doi.org/10.1186/s13362-016-0025-5],
[Article]

2015

Casper, Thorben and Schöps, Sebastian and De Gersem, Herbert (2015):
Electrothermal co-simulation of device structures in electronics.
In: YIC GACM 2015 — 3rd ECCOMAS Young Investigators Conference, [Conference or Workshop Item]

This list was generated on Fri Dec 6 03:27:55 2019 CET.